STATS ChipPAC

The world's leading integrated circuit back-end manufacturing and technology services provider

Semiconductor Manufacturing · ~2,858 employees · Singapore , Singapore

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2k+

Employees

Semiconductor Manufacturing

Industry

Singapore , Singapore

Headquarters

About STATS ChipPAC

STATS ChipPAC is the world’s leading semiconductor back-end manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world.

Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive, and industrial, through advanced wafer-level packaging, 2.5D/3D, System-in-Package, and reliable flip chip and wire bonding technologies. STATS ChipPAC has R&D centers and manufacturing powerhouses in Singapore and Korea, and business operations around the world, providing close technology collaboration and efficient supply-chain manufacturing to our global customers.

Specialities

semiconductor package assembly semiconductor test System-in-Package Wafer Level Packaging Flip Chip Packaging Wafer Bumping

Inside track

AI-generated insights to help you apply smarter. Based on public information.

Leadership

Tan Lay Keng

Chief Executive Officer

Work culture

STATS ChipPAC offers a dynamic work environment with a strong emphasis on innovation and teamwork. The company culture values collaboration, open communication, and continuous learning. Employees have opportunities for growth and development through training programs and mentorship. The company strives to maintain a healthy work-life balance, with benefits and policies in place to support employees' well-being. Overall, STATS ChipPAC provides a challenging and rewarding work environment that fosters professional growth and personal development.

Interview pattern

3 rounds · 2-4 weeks

screening → technical → panel

› Be prepared to discuss your technical skills and experience
› Show enthusiasm and interest in the company and role
› Ask thoughtful questions during the interview

Benefits

Health Insurance
Annual Leave
Training And Development Programs

Tech stack

semiconductor manufacturing software package design tools test and measurement equipment

Team building

STATS ChipPAC structures its teams around agile principles, with a focus on collaboration and cross-functional communication. The company has a hierarchical structure, with clear lines of authority and decision-making processes. Teams are often organized into pods or workgroups, with a mix of onshore and offshore personnel. The company's hiring approach emphasizes finding talented and motivated individuals who fit the company culture and values.

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